The new thick-film frequency electronic ballasts for low power discharge lamps / Gondek J., Kordowiak S., Mysinski W., Kawa B., Kocol J., Gebik P., Szatynski P. // W: IMAPS : international symposium on ... więcej

The new thick-film frequency electronic ballasts for low power discharge lamps / Gondek J., Kordowiak S., Mysinski W., Kawa B., Kocol J., Gebik P., Szatynski P. // W: IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002) / The International Society for Optical Engineering. – [S.l.] : [s.n.], 2002. – (Proceedings of SPIE, ISSN 0277-786X ; 4931). – S. 292-294

High pressure light sources: metal halide lamps and sodium discharge lamps are nowadays commonly used for the illumination of roads, streets, stadiums and rooms. They have a high coefficient of colours ... więcej

High pressure light sources: metal halide lamps and sodium discharge lamps are nowadays commonly used for the illumination of roads, streets, stadiums and rooms. They have a high coefficient of colours turn-over, high light efficiency and long life. One of the method of increase operational reliability, and service life of discharge lamps is applications full electronic stabilized-ignition circuits supply from main, instead classical inductive ballast and starter. This circuit is the electronic converter (ballast). Contemporary stabilized-ignition circuits are generally electronic ones, and increasingly, they are built using thick-film technologies. This paper examines the results of research works carried out at the research Centres in Cracow. The research work was focused on the development of new hybrid microelectronic thick-film converters for discharge lamps. The article also discussed electronic circuits that utilize high technology materials and hybrid modules technologies as well as the application of specific integrated circuits. It was the thick film technologies and-surface mount technology that were used to build the microelectronic converters. Mention is also made of advanced technologies for assembling and packaging. Finally, the development prospects of hybrid circuits are outlined.