Prediction method of input parameters impacting of dimensional accuracy of high aspect ratio holes obtained by using EDD / M. Machno, A. Matras // W: Photonics Applications in Astronomy, Communications, ... więcej

Prediction method of input parameters impacting of dimensional accuracy of high aspect ratio holes obtained by using EDD / M. Machno, A. Matras // W: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments, 26 May - 2 June 2019, Wilga, Poland [Dokument elektroniczny] / eds. by Ryszard S. Romaniuk, Maciej Linczuk ; org. by Institute of Electronic Systems. Faculty of Electronics and Information Technologies. Warsaw University of Technology (Poland). – Washington : Society of Photo-Optical Instrumentation Engineers (SPIE), 2019. – (Proceedings of SPIE, ISSN 1996-756X ; 11176). – 8 s. : rys., tab., wykr. – Tryb dostępu: https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11176. – Bibliogr. 27 poz., Abstr. – doi: 10.1117/12.2536749

This paper deals with the optimization of technological parameters (such as discharge voltage, current amplitude, time of impulse) to improve a dimensional accuracy of high aspect ratio holes obtained ... więcej

This paper deals with the optimization of technological parameters (such as discharge voltage, current amplitude, time of impulse) to improve a dimensional accuracy of high aspect ratio holes obtained by using electrical discharge drilling (EDD). High aspect ratio holes characterize aspect ratio length to diameter of hole above 10 and diameter less than 1 mm. Due to drilling the holes included difficulties, especially in case applying difficult–to–machine materials as workpiece. In the first part of the article, based on the results analysis of experimental research, a mathematical model is developed. The second part of the study presents the results analysis of method prediction of selected process parameters which influence the technological factors such as linear tool wear, material removal rate and conicity angle.